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1. general description the cbt16292 is a 12-bit 1-of-2 high-speed ttl-compatible multiplexer/demultiplexer. the low on resistance of the switch allows connections to be made with minimal propagation delay. when the select input (s) is low, port na is connected to port nb1 and port nb2 is connected to gnd via an internal pull-down resistor (500 w ). when select input (s) is high, port na is connected to port nb2 and nb1 is connected to gnd via an internal pull-down resistor (500 w ). the cbt16292 is characterized for operation from C40 c to +85 c. 2. features n 6 w switch connection between two ports n ttl compatible input levels n break-before-make feature n internal 500 w pull-down resistors to ground n esd protection: u hbm jesd22-a114e class 2 exceeds 2000 v u mm jesd22-a115-a exceeds 200 v u cdm jesd22-c101c exceeds 1000 v n latch-up performance exceeds 500 ma per jesd 78 3. ordering information cbt16292 12-bit 1-of-2 multiplexer/demultiplexer rev. 02 18 april 2008 product data sheet table 1. ordering information type number package temperature range name description version cbt16292dgg - 40 c to 85 c tssop56 plastic thin shrink small outline package; 56 leads; body width 6.1 mm sot364-1
cbt16292_2 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 02 18 april 2008 2 of 11 nxp semiconductors cbt16292 12-bit 1-of-2 multiplexer/demultiplexer 4. functional diagram fig 1. logic symbol fig 2. logic diagram 001aah983 53 54 1b2 1b1 2 1a 51 52 2b2 2b1 4 2a 48 50 3b2 3b1 6 3a 46 47 4b2 4b1 9 4a 44 45 5b2 5b1 11 5a 42 43 6b2 6b1 13 6a 40 41 7b2 7b1 15 7a 37 39 8b2 8b1 18 8a 35 36 9b2 9b1 21 9a 33 34 10b2 10b1 23 10a 31 32 11b2 11b1 25 11a 29 30 12b2 12b1 27 12a 1 s 001aah984 500 w 500 w 53 54 2 1b2 1b1 1a 500 w 500 w 29 30 27 12b2 12b1 12a 1 s
cbt16292_2 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 02 18 april 2008 3 of 11 nxp semiconductors cbt16292 12-bit 1-of-2 multiplexer/demultiplexer 5. pinning information 5.1 pinning 5.2 pin description fig 3. pin con?guration sot364-1 (tssop56) cbt16292 s n.c. 1a n.c. n.c. 1b1 2a 1b2 n.c. 2b1 3a 2b2 n.c. 3b1 gnd gnd 4a 3b2 n.c. 4b1 5a 4b2 n.c. 5b1 6a 5b2 n.c. 6b1 7a 6b2 n.c. 7b1 v cc 7b2 8a 8b1 gnd gnd n.c. 8b2 9a 9b1 n.c. 9b2 10a 10b1 n.c. 10b2 11a 11b1 n.c. 11b2 12a 12b1 n.c. 12b2 001aah985 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 table 2. pin description symbol pin description s 1 select input na 2, 4, 6, 9, 11, 13, 15, 18, 21, 23, 25, 27 common input or output (1a to 12a) n.c. 3, 5, 7, 10, 12, 14, 16, 20, 22, 24, 26, 28, 55, 56 not connected gnd 8, 19, 38, 49 ground (0 v) v cc 17 supply voltage nb1 54, 52, 50, 47, 45, 43, 41, 39, 36, 34, 32, 30 independent input or output (1b1 to 12b1) nb2 53, 51, 48, 46, 44, 42, 40, 37, 35, 33, 31, 29 independent input or output (1b2 to 12b2)
cbt16292_2 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 02 18 april 2008 4 of 11 nxp semiconductors cbt16292 12-bit 1-of-2 multiplexer/demultiplexer 6. functional description [1] h = high voltage level; l = low voltage level. 7. limiting values [1] stresses beyond those listed may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposur e to absolute-maximum-rated conditions for extended periods may affect device reliability. [2] the performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create j unction temperatures which are detrimental to reliability. the maximum junction temperature of this integrated circuit should not exceed 150 c. [3] the input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. [4] p tot derates linearly with 8 mw/k above 55 c. 8. recommended operating conditions table 3. function selection [1] s input channel on l na to nb1 or nb1 to na (nb2 connected to gnd via internal resistor (500 w ) h na to nb2 or nb2 to na (nb1 connected to gnd via internal resistor (500 w ) table 4. limiting values [1] [2] in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cc supply voltage - 0.5 +7.0 v v i input voltage [3] - 0.5 +7.0 v i ik input clamping current v i <0v - 50 - ma i sw switch current continuous current through channel - 128 +128 ma t stg storage temperature - 65 +150 c p tot total power dissipation t amb = - 40 c to +125 c [4] - 600 mw table 5. operating conditions all unused control inputs of the device must be held at v cc or gnd to ensure proper device operation. symbol parameter conditions min max unit v cc supply voltage 4.0 5.5 v v ih high-level input voltage 2.0 - v v il low-level input voltage - 0.8 v t amb ambient temperature operating in free-air - 40 +85 c
cbt16292_2 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 02 18 april 2008 5 of 11 nxp semiconductors cbt16292 12-bit 1-of-2 multiplexer/demultiplexer 9. static characteristics [1] all typical values are measured at t amb =25 c. [2] this is the increase in supply current for each input that is at the speci?ed ttl voltage level rather than v cc or gnd. [3] measured by the voltage drop between the a and the b terminals at the indicated current through the switch. on resistance is determined by the lowest voltage of the two (a or b) terminals. 10. dynamic characteristics [1] this parameter is warranted but not production tested. the propagation delay is based on the rc time constant of the typical on resistance of the switch and a load capacitance, when driven by an ideal voltage source (zero output impedance). [2] t pd is the same as t plh and t phl . t en is the same as t pzl and t pzh . t dis is the same as t plz and t phz . [3] time interval between break and make measured at the same operating point (v cc and temperature). table 6. static characteristics t amb = - 40 c to +85 c. symbol parameter conditions min typ [1] max unit v ik input clamping voltage v cc = 4.5 v; i i = - 18 ma - - - 1.2 v i i input leakage current v cc = 5.5 v; v i =v cc or gnd - - 5 m a i cc supply current v cc = 5.5 v; i o = 0 ma; v i =v cc or gnd --3 m a d i cc additional supply current per input; v cc = 5.5 v; one input at 3.4 v, other inputs at v cc or gnd [2] - - 2.5 ma c i input capacitance select input s; v cc = 5.0 v; v i = 3 v or 0 v -4-pf c io(off) off-state input/output capacitance v o = 3 v or 0 v; v cc = 0 v - 6 - pf r on on resistance v cc = 4.5 v [3] v i =0v; i i = 64 ma - 8 12.5 w v i =0v; i i =30ma - 8 11 w v i = 2.4 v; i i = 15 ma - 13 16 w table 7. dynamic characteristics t amb = - 40 c to +85 c; v cc = 5.0 v 0.5 v; for test circuit see figure 6 . symbol parameter conditions min typ max unit t pd propagation delay na, nbn to nbn, na; see figure 4 [1] [2] - - 0.4 ns t en enable time s to na, nbn; see figure 5 [2] 1.5 - 6.0 ns t dis disable time s to na, nbn; see figure 5 [2] 2.2 - 5.5 ns t b-m break-before-make time na, nbn to nbn, na [3] 0 - 2.0 ns
cbt16292_2 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 02 18 april 2008 6 of 11 nxp semiconductors cbt16292 12-bit 1-of-2 multiplexer/demultiplexer 11. waveforms measurement points are given in t ab le 8 . v ol and v oh are typical output voltage levels that occur with the output load. fig 4. input (na or nbn) to output (nbn or na) propagation delays 001aah986 output input gnd t plh v m v i v oh v ol v m v m v m t phl measurement points are given in t ab le 8 . v ol and v oh are typical output voltage levels that occur with the output load. fig 5. enable and disable times 001aah987 v m v m t pzl t plz t pzh t phz v m v ol + 0.3 v v oh - 0.3 v v m v i gnd output off to low low to off s input 3.5 v output off to high high to off v ol v oh gnd table 8. measurement points supply voltage input output v cc v m v i v m 4.5 v to 5.5 v 1.5 v gnd to 3.0 v 1.5 v
cbt16292_2 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 02 18 april 2008 7 of 11 nxp semiconductors cbt16292 12-bit 1-of-2 multiplexer/demultiplexer test data is given in t ab le 9 . de?nitions for test circuit: r l = load resistance. c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to the output impedance z o of the pulse generator. v ext = external voltage for measuring switching times. fig 6. test circuit v ext v cc v i v o mna616 dut c l r t r l r l g table 9. test data supply voltage input load v ext v cc v i t r = t f c l r l t plh , t phl t pzh , t phz t pzl , t plz 4.5 v to 5.5 v gnd to 3.0 v 2.5 ns 50 pf 500 w open open 7.0 v
cbt16292_2 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 02 18 april 2008 8 of 11 nxp semiconductors cbt16292 12-bit 1-of-2 multiplexer/demultiplexer 12. package outline fig 7. package outline sot364-1 (tssop56) unit a 1 a 2 a 3 b p cd (1) e (2) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.2 0.1 8 0 o o 0.1 dimensions (mm are the original dimensions). notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. sot364-1 99-12-27 03-02-19 w m q a a 1 a 2 d l p q detail x e z e c l x (a ) 3 0.25 128 56 29 y pin 1 index b h 1.05 0.85 0.28 0.17 0.2 0.1 14.1 13.9 6.2 6.0 0.5 1 8.3 7.9 0.50 0.35 0.5 0.1 0.08 0.25 0.8 0.4 p e v m a a tssop56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm sot364-1 a max. 1.2 0 2.5 5 mm scale mo-153
cbt16292_2 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 02 18 april 2008 9 of 11 nxp semiconductors cbt16292 12-bit 1-of-2 multiplexer/demultiplexer 13. abbreviations 14. revision history table 10. abbreviations acronym description cdm charged device model dut device under test esd electrostatic discharge hbm human body model mm machine model ttl transistor-transistor logic table 11. revision history document id release date data sheet status change notice supersedes cbt16292_2 20080418 product data sheet - cbt16292_1 modi?cations: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? changed t en from 5.8 ns to 6.0 ns in t ab le 7 dynamic char acter istics . cbt16292_1 19990913 product speci?cation - -
cbt16292_2 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 02 18 april 2008 10 of 11 nxp semiconductors cbt16292 12-bit 1-of-2 multiplexer/demultiplexer 15. legal information 15.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 15.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 15.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. quick reference data the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 15.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 16. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors cbt16292 12-bit 1-of-2 multiplexer/demultiplexer ? nxp b.v. 2008. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 18 april 2008 document identifier: cbt16292_2 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 17. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 functional description . . . . . . . . . . . . . . . . . . . 4 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 recommended operating conditions. . . . . . . . 4 9 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 10 dynamic characteristics . . . . . . . . . . . . . . . . . . 5 11 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 14 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 15 legal information. . . . . . . . . . . . . . . . . . . . . . . 10 15.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 15.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 15.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 15.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 16 contact information. . . . . . . . . . . . . . . . . . . . . 10 17 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

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